Method and system for a transformer in an integrated circuit package

ABSTRACT

Aspects of a method and system for a transformer in an integrated circuit package are provided. In this regard, signals may be transmitted and/or received via an antenna communicatively coupled to a transformer embedded in multi-layer integrated circuit package. The windings ratio of the transformer may be configured based on an impedance of the antenna, an impedance of a transmitter coupled to the transformer, an impedance of an LNA coupled to the transformer, and/or a power level of the received and/or transmitted signals. The windings ratio may be configured via one or more switching elements which may be MEMS switches embedded in the multi-layer IC package. The transformer may comprise a plurality of loops fabricated on a corresponding plurality of metal layers in the multi-layer IC package, and the loops may be communicatively coupled with one or more vias. The multi-layer IC package may comprise ferromagnetic and/or ferromagnetic materials.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

Not Applicable

FIELD OF THE INVENTION

Certain embodiments of the invention relate to signal processing. Morespecifically, certain embodiments of the invention relate to a methodand system for a transformer in an integrated circuit package.

BACKGROUND OF THE INVENTION

Mobile communications have changed the way people communicate and mobilephones have been transformed from a luxury item to an essential part ofevery day life. The use of mobile phones is today dictated by socialsituations, rather than hampered by location or technology. While voiceconnections fulfill the basic need to communicate, and mobile voiceconnections continue to filter even further into the fabric of every daylife, the mobile Internet is the next step in the mobile communicationrevolution. The mobile Internet is poised to become a common source ofeveryday information, and easy, versatile mobile access to this datawill be taken for granted.

As the number of electronic devices enabled for wireline and/or mobilecommunications continues to increase, significant efforts exist withregard to making such devices more power efficient. For example, a largepercentage of communications devices are mobile wireless devices andthus often operate on battery power. Additionally, transmit and/orreceive circuitry within such mobile wireless devices often account fora significant portion of the power consumed within these devices.Moreover, in some conventional communication systems, transmittersand/or receivers are often power inefficient in comparison to otherblocks of the portable communication devices. Accordingly, thesetransmitters and/or receivers have a significant impact on battery lifefor these mobile wireless devices.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with some aspects of the present invention asset forth in the remainder of the present application with reference tothe drawings.

BRIEF SUMMARY OF THE INVENTION

A system and/or method for a transformer in an integrated circuitpackage, substantially as shown in and/or described in connection withat least one of the figures, as set forth more completely in the claims.

These and other advantages, aspects and novel features of the presentinvention, as well as details of an illustrated embodiment thereof, willbe more fully understood from the following description and drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a diagram of a hybrid circuit comprising a transformerembedded in a multi-layer integrated circuit (IC) package, in accordancewith an embodiment of the invention.

FIG. 1B is a diagram of a transformer with configurable windings ratio,in accordance with an embodiment of the invention.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer package with embedded transformer, in accordance with anembodiment of the invention.

FIG. 2B is an exemplary top view of a transformer embedded in amulti-layer IC package, in accordance with an embodiment of theinvention.

FIG. 3 is a flow chart illustrating exemplary steps for transmittingsignals utilizing a configurable transformer, in accordance with anembodiment of the invention.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Certain embodiments of the invention may be found in a method and systemfor a transformer in a multi-layer integrated circuit package. In thisregard, signals may be transmitted and/or received via an antennacommunicatively coupled to a transformer embedded in multi-layerintegrated circuit package. In various exemplary embodiments of theinvention, the windings ratio of the transformer may be configured basedon an impedance of the antenna, an impedance of a transmitter coupled tothe transformer, an impedance of a receiver coupled to the transformer,and/or a power level of the received and/or transmitted signals. Also,the windings ratio may be configured via one or more switching elementswhich may be MEMS switches embedded in the multi-layer IC package. In anexemplary embodiment of the invention, the transformer may comprise aplurality of loops fabricated on a corresponding plurality of metallayers in the multi-layer IC package, and the loops may becommunicatively coupled with one or more vias. The multi-layer ICpackage may comprise ferromagnetic and/or ferromagnetic materials.

FIG. 1A is a diagram of a hybrid circuit comprising a transformerembedded in a multi-layer integrated circuit (IC) package, in accordancewith an embodiment of the invention. Referring to FIG. 1A there is showna hybrid circuit 100 (may also be referred to as a hybridized circuit,or a hybrid or hybridized package) comprising an IC 106 and amulti-layer IC package 104. The IC 106 may be bonded to the multi-layerIC package. The IC may comprise a transceiver 423 and the multi-layer ICpackage 104 may comprise a transformer 112 and an antenna 421. Invarious other embodiments of the invention, the antenna 421 may beseparate from the hybrid circuit 100. Although a single transceiver 423is illustrated, the invention is not so limited. Accordingly, a separatetransmitter and/or receiver may be utilized without departing from thescope of the invention.

The IC 106 may comprise suitable logic, circuitry, and/or code forperforming one or more functions associated with transmitting and/orreceiving RF signals. In this regard, the IC 106 may comprise all or aportion of the system 420 described with respect to FIG. 4. The IC 106may utilize a transformer embedded in the multi-layer integrated circuitpackage 104 for transmitting and/or receiving RF signals. In thisregard, the transformer 112 may enable coupling signals to betransmitted from the transceiver 423 to the antenna 421 and couplingsignals received by the antenna 421 to the transceiver 423. In variousembodiments of the invention, the windings ratio of the transformer maybe configurable. In this regard, the IC 106 may comprise suitable logic,circuitry and/or code for configuring the transformer 112. For example,the windings ratio may be configured based on a transmitted and/orreceived signal power and/or based on an impedance of the transceiver423 and/or the antenna 421.

The multi-layer IC package 104 may comprise one or more layers of metaland/or insulating material. In this regard, the multi-layer IC package104 may be fabricated in a manner similar to or the same as the IC 106.Accordingly, the layers may be utilized to realize circuit exemplaryelements comprising resistors, inductors, capacitors, transmissionlines, switches, antennas, etc. In one exemplary embodiments of theinvention, one or more switching elements and one or more transformersmay be fabricated in the multi-layer IC package 104. Accordingly, aconfigurable transformer may be realized in the multi-layer IC package104 wherein opening/closing the switches may alter the windings ratio ofthe transformer 112.

The transformer 112 may comprise two or more windings and a core. Invarious embodiments of the invention, the number of loops in the primaryand/or secondary winding may be configurable. In this manner, thetransformer 112 may enable impedance matching a range of transceiver 423impedances to a range of antenna 421 impedances. In various embodimentsof the invention, the core of the transformer 112 may compriseferromagnetic material.

In an exemplary transmit operation, the transceiver may comprise a poweramplifier (PA) 108 which may communicate a signal to the antenna 421 viathe transformer 112. In this regard, altering the load of the poweramplifier 108 by configuring the windings ratio of the transformer 112may improve the impedance match between the power amplifier and theantenna 421 improving the efficiency of the transmission. Also, alteringthe windings ratio may enable maintaining signals levels at the outputof the power amplifier 108 between determined thresholds.

In an exemplary receive operation, the transceiver 423 may comprise alow noise amplifier (LNA) 110 which receives a signal from the antenna421 via the transformer 112. In this regard, configuring the windingsratio of the transformer may improve the impedance match between thetransceiver 423 and the antenna 421 improving the coupling or receivedsignal energy to the low noise amplifier 110. Also, altering thewindings ratio may enable maintaining signal levels at the input of thelow noise amplifier 110 between determined thresholds.

FIG. 1B is a diagram of a transformer with configurable windings ratio,in accordance with an embodiment of the invention. Referring to FIG. 1Bthere is shown a transformer 112 with terminals 152 a, 152 b, 162 a, and162 b, a switch network 154, a first winding 156, a transformer core158, and a second winding 160.

The terminals 152 a and 152 b may be inputs and/or outputs to the firstwinding 156. In the exemplary embodiment of the invention depicted, thenumber of turns (also referred to as loops) between terminals 152 a and152 b may be variable. The terminals 162 a and 162 b may be the inputsand/or outputs to the second winding 160. In the exemplary embodiment ofthe invention depicted, the number of turns (loops) between theterminals 162 a and 162 b may be fixed.

The switch network 154 may comprise suitable logic, circuitry, and/orcode for communicatively coupling the terminals 152 a and 152 b to oneor more turns of the first winding 156. The switch network 154 may becontrolled via one or more control signals from, for example, theprocessor 425 and/or the baseband processor 427 described with respectto FIG. 4. In the exemplary embodiment of the invention depicted, theswitches, within the switch network 154, in the position indicated bythe solid lines may result in three turns between the terminals 152 aand 152 b, whereas the switches in the position indicated by the dashedlines may result in one turn between the terminals 152 a and 152 b. Inthe exemplary embodiment of the invention depicted, the winding 160 hastwo turns. Thus, the windings ratio is configurable between 3:2 and 1:2(first winding: second winding).

The transformer core 518 may comprise a material suitable forconcentrating the flux generated by one winding to induce a current inthe other winding. In various exemplary embodiments of the invention,the core may comprise ferromagnetic material within the multi-layer ICpackage 104.

In various embodiments of the invention, the first winding 156 may bethe primary winding or the secondary winding, and the second winding 160may be the secondary winding or the primary winding. Additionally, bothwindings may comprise a variable number of turns configured via one ormore switch networks.

In operation, the control signal may configure the switch network 154based, for example, on an impedance communicatively coupled to theterminals 152 a, 152 b and terminals 162 a, 162 b. For example, for theterminal 152 a, 152 b may be communicatively coupled to a poweramplifier and the terminals 162 a, 162 b may be coupled to an antenna.Accordingly, the switches may be in the dashed line configuration forhigh (e.g., PA 108) output power and the switches may be in the solidline configuration for low PA (e.g., PA 108) output power. In thismanner, the voltage swing at the output of the PA (e.g., PA 108) may bemaintained, for example, within safe levels so as not to damage CMOScircuitry.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer package with embedded transformer, in accordance with anembodiment of the invention. Referring to FIG. 2, there is shown ahybrid circuit 100 comprising an IC 106 and a multi-layer IC package104. The multi-layer IC package 104 may comprise an insulating material203; metal layers 202; vias 220 a, 220 b (not shown), 222 a, 222 b (notshown), 224, and 226; and MEMS switches 154. Additionally, in variousembodiments of the invention, the multi-layer IC package 104 maycomprise one or more layers and/or areas of ferromagnetic and/orferrimagnetic material. The IC 106 may be coupled to the multi-layer ICpackage 104, and the package 104 to a PCB (not shown), via solder balls208. A surface mount component 252 may be mounted to the multi-layer ICpackage 104, and thermal epoxy 214 may be pressed between the IC 106 andthe multi-layer IC package 104.

The IC 106 may be as described with respect to FIG. 1. Additionally, theIC 106 may be bump-bonded or flip-chip bonded to the multi-layer ICpackage 104 utilizing solder balls (e.g. solder balls 208 as describedwith respect to FIG. 2A below). In this manner, wire bonds connectingthe IC 106 to the multi-layer IC package 104 may be eliminated, reducingand/or eliminating uncontrollable stray inductances due to wire bonds.In addition, the thermal conductance out of the IC 106 may be greatlyimproved utilizing the solder balls 208 and the thermal epoxy 214. Thethermal epoxy 214 may be electrically insulating but thermallyconductive to allow for thermal energy to be conducted out of the IC 106to the much larger thermal mass of the multilayer package 104.

The solder balls 208 may comprise spherical balls of metal to provideelectrical, thermal and physical contact between the IC 106 and themulti-layer IC package 104. In making the contact with the solder balls208, the IC 106 may be pressed with enough force to squash the metalspheres somewhat, and may be performed at an elevated temperature toprovide suitable electrical resistance and physical bond strength. Thesolder balls 208 may also be utilized to provide electrical, thermal andphysical contact between the multi-layer IC package 104 and a printedcircuit board comprising other parts of, for example, the wirelesssystem 420 described with respect to FIG. 4.

The surface mount device 252 may comprise a discrete circuit elementsuch as resistors, capacitors, inductors, and diodes, for example. Thesurface mount device 252 may be soldered to the multi-layer IC package104 to provide electrical contact. In various embodiments of theinvention, additional surface mount elements or no surface mountelements may be coupled to the multi-layer IC package 104.

In an exemplary embodiment of the invention, the metal layer 202, mayeach comprise a deposited metal layer utilized to delineate the twotransformer windings 156 (comprised of loops 156 ₁, 156 ₂, and 156 ₃)and 160 (comprised of loops 160 ₁, 160 ₂) described with respect to FIG.1B and the antenna 421 described with respect to FIG. 4. In this regard,the metal layer 202 may be deposited in shapes and/or sizes which enablevarying characteristics of the transformer 112 and the antenna 421.

In an exemplary embodiment of the invention, the vias 220 a, 220 b (notshown), 222 a, 222 b (not shown) may comprise metal and/or otherconductive material(s) which may communicatively couple the metal layers202 to one another and to the solder balls 208. In this manner, signalsmay be conveyed to and/or from the transformer windings 156 and 160, theIC 106, and the antenna 421. In the exemplary embodiment of theinvention depicted, vias 220 a 222 a may communicatively couple positiveterminals of loops 156 ₁, 156 ₂, and 156 ₃ and vias 220 b and 222 b (notshown) may couple negative terminals of loops 156 ₁, 156 ₂, and 156 ₃.Similarly, via 224 may connect a negative terminal of loop 160 ₁ to apositive terminal of loop 160 ₂.

In an exemplary embodiment of the invention, the switch network 154described with respect to FIG. 1B may be implemented as MEMS switches inthe multi-layer IC package 104. In this regard, the MEMS switches 154may close when, for example a magnetic field is induced on a switchterminal. In this regard, the MEMS switches 154 may each comprise a thinconductive element or film which when in the open position is suspendedabove a switch terminal (as indicated by the solid lines in FIG. 2) andwhen in the closed position is in contact with a switch terminal (asindicated by the dashed lines in FIG. 2). Accordingly, energizing theterminal, for example, may generate an attracting force that draws theelement of film into contact with the terminal.

In operation, the IC 106 and associated multi-layer IC package 104 maybe utilized to transmit and/or receive RF signals. The IC 106 may beelectrically coupled to the antenna 421 embedded on and/or within themulti-layer IC package 104 via a configurable transformer embedded onand/or within the multi-layer IC package 104. The windings ratio of thetransformer may be configured via the switch network 154. In thisregard, when both switches are closed the windings ratio may be 3:2,when one switch is open the windings ratio may be 2:2, and when bothswitches are open the windings ratio may be 1:2. Logic, circuitry,and/or code in the IC 106 may control the switches 154. In variousembodiments of the invention, additional devices (e.g., capacitors,inductors, resistors) may be integrated into the multi-layer IC packagewithout deviating from the scope of the present invention. Additionally,although a transformer comprising five loops is depicted, variousexemplary embodiments of the invention may comprise any number of metallayers, transformer loops, switching elements, without deviating fromthe scope of the invention.

FIG. 2B is an exemplary top view of a transformer embedded in amulti-layer IC package, in accordance with an embodiment of theinvention. Referring to FIG. 2B there is shown a multi-layer IC package104, with embedded transformer. In this regard, FIG. 2B may be analternate view of the transformer 112 described with respect to FIGS.1A, 1B and 2A. Shown in FIG. 2B, but not depicted in FIG. 2A, are theterminal 250, and the capacitors 252 a, 252 b, and 252 c.

The terminal 250 may provide a tap into the winding 156 such that a DCbias may be applied to the winding. In this regard, a DC bias applied tothe center of the winding 156 may be utilized, for example, when abalanced (differential) signal is communicatively coupled to the winding156.

The capacitors 252 a, 252 b, 252 c may be bypass capacitors to ground,and which may be communicatively coupled to the terminals 152 a and 152b of the winding 156 and communicatively coupled to the positiveterminal 226 of the winding 160 (the antenna 421 of FIG. 2A is not shownin FIG. 2B)

FIG. 3 is a flow chart illustrating exemplary steps for transmittingsignals utilizing a configurable transformer, in accordance with anembodiment of the invention. Referring to FIG. 3 the exemplary steps maybegin with step 302 when the transceiver 423 may be ready to begintransmitting signals. Subsequent to step 302, the exemplary steps mayadvance to step 304. In step 304, an output power for transmission maybe determined. In this regard, the destination, type of transmission,etc. may be utilized to determine how strong of a signal to transmit.Subsequent to step 304, the exemplary steps may advance to step 306.

In step 306, a power amplifier of the transceiver 423 may be configured.For example, devices sizing, supply voltages, bias voltages, etc. may beconfigured such that the PA may transmit at the power level determinedin step 304. Subsequent to step 306, the exemplary steps may advance tostep 308.

In step 308, the antenna 421 may be configured. In this regard, theantenna may, for example, be a phased array and/or a have configurableshape, size, etc. based on the signal to be transmitted. Subsequent tostep 308, the exemplary steps may advance to step 310.

In step 310, the transformer 112 communicatively coupling thetransceiver 423 to the antenna 421 may be configured to improve animpedance match and/or power efficiency. In this regard, the transformer112 may be configured based on, for example, the output impedance of thepower amplifier, the input impedance of the antenna, and/or the outputpower. Subsequent to step 310, the exemplary steps may advance to step312.

In step 312, the signal to be transmitted may be communicated from thepower amplifier (in the transceiver 423) to the antenna 421 via thetransformer 112.

Steps similar to those described with respect to FIG. 3 may also beapplied to receiving signals utilizing a configurable transformerembedded in a multi-layer IC package.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention. Referring to FIG. 4,there is shown a wireless device 420 that may comprise an RF transceiver423, a digital baseband processor 429, a processor 425, and a memory427. The transceiver 423 may comprise a receiver 423 a and a transmitter423 b. An antenna 421 may be communicatively coupled to the RFtransceiver 423 via the transformer 112. The wireless device 420 may beoperated in a system, such as the cellular network and/or digital videobroadcast network, for example.

In an exemplary embodiment of the invention, the antenna 421 maycomprise one or more antenna elements which may be coupled and/ordecoupled via one or more switching elements. In this regard, theantenna 421 may be configured based on frequency, polarization, gain,etc. In another exemplary embodiment of the invention, the antenna 421may be a phased array antenna. In this regard, the directivity of theantenna may be controlled by adjusting the phase(s) of signalscommunicatively coupled to the antenna.

The RF receiver 423 a may comprise suitable logic, circuitry, and/orcode that may enable processing of received RF signals. The RF receiver423 a may enable receiving RF signals in a plurality of frequency bands.For example, the RF receiver 423 a may enable receiving signals inextremely high frequency (e.g., 60 GHz) bands. The receiver 423 a may beenabled to receive, filter, amplify, down-convert, and/or perform analogto digital conversion. The RF receiver 423 a may down convert a receivedRF signal. In this regard, the RF receiver 423 a may perform direct downconversion of the received RF signal to a baseband or may convert thereceived RF signal to an intermediate frequency (IF). In variousembodiments of the invention, the receiver 423 a may perform quadraturedown-conversion where in-phase components and quadrature phasecomponents may be processed in parallel. The receiver 423 a may beenabled to receive signals via the transformer 112, which may beconfigurable and provide a means of impedance matching the receiver 423a to the antenna 421. In various embodiments of the invention, thewireless device 420 may comprise a plurality of the receivers 423 a andmay thus support multiple frequency bands and or simultaneous receptionof signals in the same frequency band.

The digital baseband processor 429 may comprise suitable logic,circuitry, and/or code that may enable processing and/or handling ofbaseband signals. In this regard, the digital baseband processor 429 mayprocess or handle signals received from the RF receiver 423 a and/orsignals to be transferred to the RF transmitter 423 b, when the RFtransmitter 423 b is present, for transmission to the network. Thedigital baseband processor 429 may also provide control and/or feedbackinformation to the RF receiver 423 a and to the RF transmitter 423 bbased on information from the processed signals. In this regard, thebaseband processor 429 may provide one or more control signals forconfiguring the transformer 112 via one or more switching elements. Thedigital baseband processor 429 may communicate information and/or datafrom the processed signals to the processor 425 and/or to the memory427. Moreover, the digital baseband processor 429 may receiveinformation from the processor 425 and/or to the memory 427, which maybe processed and transferred to the RF transmitter 423 b fortransmission to the network.

The RF transmitter 423 b may comprise suitable logic, circuitry, and/orcode that may enable processing of RF signals for transmission. Thetransmitter 423 b may be enabled to transmit signals via the transformer112, which may be configurable and provide a means of impedance matchingthe transmitter 423 b to the antenna 421. The RF transmitter 423 b mayenable transmission of RF signals in a plurality of frequency bands. Forexample, the RF transmitter 423 b may enable transmitting signals incellular frequency bands. Each frequency band supported by the RFtransmitter 423 b may have a corresponding front-end circuit forhandling amplification and up conversion operations, for example. Inthis regard, the RF transmitter 423 b may be referred to as a multi-bandtransmitter when it supports more than one frequency band. In anotherembodiment of the invention, the wireless device 420 may comprise morethan one RF transmitter 423 b, wherein each of the RF transmitter 423 bmay be a single-band or a multi-band transmitter.

In various embodiments of the invention, the RF transmitter 423 b mayperform direct up conversion of the baseband signal to an RF signal. Insome instances, the RF transmitter 423 b may enable digital-to-analogconversion of the baseband signal components received from the digitalbaseband processor 429 before up conversion. In other instances, the RFtransmitter 423 b may receive baseband signal components in analog form.

The processor 425 may comprise suitable logic, circuitry, and/or codethat may enable control and/or data processing operations for thewireless device 420. The processor 425 may be utilized to control atleast a portion of the RF receiver 423 a, the RF transmitter 423 b, thedigital baseband processor 429, and/or the memory 427. In this regard,the processor 425 may generate at least one signal for controllingoperations within the wireless device 420. In this regard, the basebandprocessor 429 may provide one or more control signals for configuringthe transformer 112 via one or more switching elements. The processor425 may also enable executing of applications that may be utilized bythe wireless device 420. For example, the processor 425 may executeapplications that may enable displaying and/or interacting with contentreceived via cellular transmission signals in the wireless device 420.

The memory 427 may comprise suitable logic, circuitry, and/or code thatmay enable storage of data and/or other information utilized by thewireless device 420. For example, the memory 427 may be utilized forstoring processed data generated by the digital baseband processor 429and/or the processor 425. The memory 427 may also be utilized to storeinformation, such as configuration information, that may be utilized tocontrol the operation of at least one block in the wireless device 420.For example, the memory 427 may comprise information necessary toconfigure the transformer 112. In this regard, the memory may storecontrol and/or configuration information for configuring the windingsratio of the transformer 112 via one or more switching elements.

In this regard, signals may be transmitted and/or received via anantenna (e.g., 421) communicatively coupled to a transformer (e.g., 112)embedded in multi-layer integrated circuit package (e.g., 104). Invarious exemplary embodiments of the invention, the windings ratio ofthe transformer may be configured based on an impedance of the antenna,an impedance of a transmitter (e.g., PA 108) coupled to the transformer,an impedance of an receiver (e.g., LNA 110) coupled to the transformer,and/or a power level of the received and/or transmitted signals. Also,the windings ratio may be configured via one or more switching elements(e.g., 154) which may be MEMS switches embedded in the multi-layer ICpackage. In an exemplary embodiment of the invention, the transformermay comprise a plurality of loops fabricated on a correspondingplurality of metal layers (e.g., 102) in the multi-layer IC package, andthe loops may be communicatively coupled with one or more vias. Themulti-layer IC package may comprise ferromagnetic and/or ferromagneticmaterials.

Another embodiment of the invention may provide a machine-readablestorage, having stored thereon, a computer program having at least onecode section executable by a machine, thereby causing the machine toperform the steps as described herein for configuring a transformerembedded in a multi-layer integrated circuit package.

Accordingly, the present invention may be realized in hardware,software, or a combination of hardware and software. The presentinvention may be realized in a centralized fashion in at least onecomputer system, or in a distributed fashion where different elementsare spread across several interconnected computer systems. Any kind ofcomputer system or other apparatus adapted for carrying out the methodsdescribed herein is suited. A typical combination of hardware andsoftware may be a general-purpose computer system with a computerprogram that, when being loaded and executed, controls the computersystem such that it carries out the methods described herein.

The present invention may also be embedded in a computer programproduct, which comprises all the features enabling the implementation ofthe methods described herein, and which when loaded in a computer systemis able to carry out these methods. Computer program in the presentcontext means any expression, in any language, code or notation, of aset of instructions intended to cause a system having an informationprocessing capability to perform a particular function either directlyor after either or both of the following: a) conversion to anotherlanguage, code or notation; b) reproduction in a different materialform.

While the present invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present invention without departing from its scope.Therefore, it is intended that the present invention not be limited tothe particular embodiment disclosed, but that the present invention willinclude all embodiments falling within the scope of the appended claims.

1. A method for signal processing, the method comprising: transmittingand/or receiving signals via an antenna communicatively coupled to atransformer embedded in multi-layer integrated circuit package, where anintegrated circuit is bonded to said multi-layer integrated circuitpackage; and configuring a windings ratio of said transformer via one ormore switching elements.
 2. The method according to claim 1, comprisingconfiguring a windings ratio of said transformer based on an impedanceof said antenna.
 3. The method according to claim 1, comprisingconfiguring a windings ratio of said transformer based on an impedanceof a transmitter coupled to said transformer.
 4. The method according toclaim 1, comprising configuring a windings ratio of said transformerbased on an impedance of a receiver coupled to said transformer.
 5. Themethod according to claim 1, comprising configuring a windings ratio ofsaid transformer based on power of transmitted and/or received signals.6. The method according to claim 1, wherein said one or more switchingelements comprise micro-electro-mechanical system (MEMS) switches withinand/or on said multi-layer IC package.
 7. The method according to claim1, wherein said transformer comprises a plurality of loops fabricated ona corresponding plurality of metal layers in said multi-layer integratedcircuit package.
 8. The method according to claim 7, wherein saidplurality of said loops are communicatively coupled with one or morevias in said multi-layer integrated circuit package.
 9. The methodaccording to claim 1, wherein ferromagnetic material is embedded in saidmulti-layer package.
 10. A system for signal processing, the systemcomprising: a transformer and one or more switching elements embedded ina multi-layer integrated circuit package, wherein: said transformerenables transmitting and/or receiving signals via an antenna; said oneor more switching elements enable configuring a windings ratio of saidtransformer; and an integrated circuit is bonded to said multi-layerintegrated circuit package.
 11. The system according to claim 10,wherein a windings ratio of said transformer is configurable based on animpedance of said antenna.
 12. The system according to claim 11, whereinone or more switching elements within and/or on said multi-layerintegrated circuit package enable configuring said windings ratio. 13.The system according to claim 10, wherein an integrated circuit bondedto said multi-layer IC package comprises logic, circuitry, and/or codefor configuring a windings ratio of said transformer.
 14. The systemaccording to claim 10, wherein a windings ratio of said transformer isconfigured based on an impedance of a transmitter communicativelycoupled to said transformer.
 15. The system according to claim 10,wherein a windings ratio of said transformer is configured based on animpedance of a receiver communicatively coupled to said transformer. 16.The system according to claim 10, wherein a windings ratio of saidtransformer is configured based on a power level of transmitted and/orreceived signals.
 17. The system according to claim 10, wherein saidtransformer comprises a plurality of loops fabricated on a correspondingplurality of metal layers in said multi-layer integrated circuitpackage.
 18. The system according to claim 17, wherein said plurality ofsaid loops are communicatively coupled with one or more vias in saidmulti-layer integrated circuit package.
 19. The system according toclaim 10, wherein ferromagnetic material is embedded in said multi-layerpackage.